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    • Home
    • High-Speed Cameras
    • Digital Image Correlation
    • Motion Analysis Software
    • Contact Us
    • Technical Insights
    • Accessories
  • Home
  • High-Speed Cameras
  • Digital Image Correlation
  • Motion Analysis Software
  • Contact Us
  • Technical Insights
  • Accessories

Digital Image Correlation Systems

Measure full-field strain, displacement and deformation using advanced Digital Image Correlation (DIC) systems for material testing, structural analysis, biomechanics, aerospace and automotive research. 

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Applications

Material Testing & Failure Analysis

Material Testing & Failure Analysis

Material Testing & Failure Analysis

Material testing and failure analysis using Digital Image Correlation

Digital Image Correlation (DIC) enables full-field measurement of strain, deformation and crack initiation during mechanical testing. Researchers use DIC to evaluate material behavior, validate simulations and investigate failure mechanisms with high accuracy. 

Biomechanics

Material Testing & Failure Analysis

Material Testing & Failure Analysis

Stereo DIC analysis of human foot biomechanics showing deformation and strain measurement.

DIC provides non-contact measurement of deformation, strain and motion in biological tissues, prosthetics and medical devices. It supports research in orthopedics, sports science, injury prevention and biomedical engineering. 

Composite Materials

Thermal & Load Studies

Thermal & Load Studies

Composite material testing using Digital Image Correlation

DIC helps characterize strain distribution, delamination and failure behavior in advanced composite materials. The technique provides valuable insights for aerospace, automotive and lightweight structure development. 

Thermal & Load Studies

Thermal & Load Studies

Thermal & Load Studies

DIC used for thermal and load studies with full-field strain and deformation measurement.

DIC enables full-field measurement of strain and deformation under combined thermal and mechanical loading conditions. Researchers use DIC to evaluate structural performance, thermal expansion and material behavior in demanding environments. 

Structural Analysis

High-Speed Deformation Analysis

High-Speed Deformation Analysis

Structural analysis using Digital Image Correlation

DIC allows engineers to measure displacement, strain and deformation across entire structures without physical contact. It is widely used for bridges, aerospace components, composites and civil engineering investigations. 

High-Speed Deformation Analysis

High-Speed Deformation Analysis

High-Speed Deformation Analysis

High-speed Digital Image Correlation for impact testing, deformation analysis and strain measurement

When combined with high-speed cameras, DIC enables measurement of strain and deformation during impact, crash and dynamic testing events. This provides quantitative data for understanding rapid material and structural responses. 

Why Use Digital Image Correlation?

Full-Field Strain Measurement

Full-Field Strain Measurement

Full-Field Strain Measurement

Measure strain distribution across an entire surface rather than at a single point, providing comprehensive insight into material behavior. 

Non-Contact Measurement

Full-Field Strain Measurement

Full-Field Strain Measurement

Capture deformation and displacement without physical sensors, eliminating the risk of influencing test results. 

2D & 3D Deformation Analysis

Full-Field Strain Measurement

High Accuracy & Repeatability

Analyze complex movements, shape changes and structural responses using advanced stereo DIC techniques. 

High Accuracy & Repeatability

High Accuracy & Repeatability

High Accuracy & Repeatability

Obtain precise, repeatable measurements suitable for research, product validation and quality assurance. 

Static & Dynamic Testing

High Accuracy & Repeatability

Static & Dynamic Testing

Perform measurements during both slow mechanical tests and high-speed events such as impacts and crashes. 

Seamless Integration

High Accuracy & Repeatability

Static & Dynamic Testing

Compatible with high-speed cameras, test machines, environmental chambers and external sensors for synchronized measurements. 

Digital Image Correlation (DIC) Solutions

DIC Embedded

DIC Embedded

DIC Embedded

Test rig for structural analysis using non-contact DIC measurement

DIC Embedded is an all-in-one Digital Image Correlation (DIC) system that integrates dual cameras, illumination and onboard processing into a compact, rugged platform. Designed for real-time 2D and 3D full-field strain and deformation measurements, it eliminates the need for an external PC, making it ideal for laboratory and field testing.


Key Specifications

  • Measurement: 2D & 3D Digital Image Correlation (DIC)
  • Integrated System: Dual industrial cameras, onboard processing and continuous LED illumination
  • Working Distance: 0.7 ± 0.15 m
  • Field of View: 135–170 mm
  • Measurement Accuracy: Up to 0.5 μm displacement resolution
  • Applications: Material testing, structural analysis, fluid mechanics and biomechanics


Key Features

  • Compact all-in-one system with integrated processing and synchronized illumination
  • Polarizing filters reduce reflections for improved measurement accuracy
  • Portable workstation with foldable 23-inch monitor, keyboard and mouse
  • Compatible with National Instruments DAQ systems, triggers and external sensors
  • Built-in analysis tools including virtual extensometers, FFT analysis, mode shape analysis and automatic material property calculations
  • Rugged design for laboratory and field environments (0 °C to +50 °C)

DIC Elite

DIC Embedded

DIC Embedded

Stereo Digital Image Correlation System with dual-cameras, lighting and laser alignment

DIC Elite is a turnkey Stereo Digital Image Correlation (DIC) system designed for high-accuracy full-field strain and displacement measurements. Its flexible imaging configuration, integrated workstation and advanced analysis tools make it suitable for both static and dynamic testing applications.


Key Specifications

  • Measurement: 2D & 3D Stereo Digital Image Correlation (DIC)
  • Camera Support: Industrial and high-speed cameras with interchangeable lenses
  • Working Distance: Up to 4 m (customizable upon request)
  • Measurement Range: Strain measurement from 0.02% to 2000%
  • Applications: Aerospace, automotive, biomechanics and materials testing


Key Features

  • Smart Laser Alignment system for rapid camera positioning and field-of-view setup
  • Continuous and shutter-synchronized lighting for a wide range of testing conditions
  • Rigid sliding bar with laser-engraved scale for accurate camera positioning
  • Portable workstation with 23-inch foldable monitor, keyboard and mouse
  • Compatible with National Instruments DAQ systems, triggers and external sensors
  • Advanced analysis tools including virtual extensometers, FFT analysis, mode shape analysis and automated material property calculations

Downloads Centre

Digital Image Correlation Embedded

Digital Image Correlation Embedded

Digital Image Correlation Embedded

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Digital Image Correlation Elite

Digital Image Correlation Embedded

Digital Image Correlation Embedded

Request Brochure

Discuss Your DIC Requirements

Discuss your application requirements with our team and receive guidance on selecting the most suitable Digital Image Correlation system for your research or testing application.

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Orbidot Technologies – Your Digital Image Correlation Partner

 Contact Orbidot Technologies to discuss your Digital Image Correlation requirements. Our team can help you select the right DIC system and provide technical guidance for research, product development and testing applications. 

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